Single component addition molding fast curing adhesive
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JDB890T300 single component heat curing thermal conductive adhesive
JDB890T300 single component heating curing adhesive is an additive high strength adhesive thermal conductive silicone material. It can be applied to the bonding and sealing of various electronic and electrical components, such as electronic devices in industries such as home appliances, automobiles, and communication.
Feature
 The components do not need to be mixed before use, making it easy to operate;

 Addition of silicone, no low molecular weight detachment during curing, resulting in a more stable product size after curing;

 Excellent thermal insulation performance helps to dissipate heat and protect thermal electronic components;

 Stable mechanical and electrical performance between -60-250 ℃;

 Excellent flame retardant performance, fully meeting the requirements of EU environmental directives.
Parameter

項目

典型值

測試标準

固化前性能(néng) ( 23±2/50±5%RH )

外觀

色膏狀物(wù)

目測

比重(g/cm3)

3.2±0.5

GB/T 533-2008

固化後性能(néng) ( 23±2/50±5%RH×7days )

固化條件120℃(Min)

30

--

邵氏硬度(Shore A)

80±10

GB/T 531.1—2008

斷裂伸長(cháng)率(%)

≥45

GB/T 528—2009

拉伸強度(MPa)

≥4.5

GB/T 528—2009

導熱率(W/(m.K))

3.0±0.2

ISO22007-2

剪切強度 AI/AI(MPa)

≥4.5

GB/T 7124—2008

介電(diàn)強度(kV/mm)

22

GB/T 1408.1—2006

介電(diàn)常數(1MHz

≤4.0

GB/T 1409—2006

體(tǐ)積電(diàn)阻率(Ω·cm)

≥1.0×1013

GB/T 1410—2006

工(gōng)作(zuò)溫度(℃)

-50200


  粘接性能(néng) ( 23±2℃/50±5%RH×7days )

基材

效果

粘結強度

金屬

極佳

1.5

黃銅                           

極佳

1.8

極佳

1.7

軟鋼                          

極佳

1.7

不鏽鋼

極佳

1.8

塑料及樹脂

樹脂                         

極佳

1.9

丙烯酸樹脂                           

0.8

環氧樹脂                       

極佳

1.7

酚醛樹脂                       

極佳

1.5

聚縮醛 POM)               

極佳

1.6

聚對苯二甲酸丁二醇脂(PBT                      

極佳

1.5

聚碳酸脂(PC)                      

1.3

聚酯薄膜(PET

極佳

1.5

聚乙烯(PE

application
The product is suitable for various electronic and electrical applications, as well as applications that require bonding, sealing, thermal conductivity, insulation, protection, moisture-proof, dustproof, etc.
Usage method
Instructions for use

 Clean and dry the surface of the adhesive object, and remove any pollutants such as rust, dust, and oil that may affect adhesion.

 Extrude the adhesive with a special tool and apply it to the cleaned joint surface.

 After the adhesive application is completed, it is moved into an oven or heated environment for curing. According to the actual situation, it is better to extend the curing time and increase the curing temperature appropriately.


matters needing attention

 Rubber materials should be stored in a sealed low temperature (below 25 ℃), and long-term storage at room temperature or high temperature environment will shorten the storage period.

 This product is not a hazardous material, but avoid contact with skin and eyes.

 Contact with a certain amount of the following chemical substances can cause the adhesive to not cure or cure incompletely:

   1.Organic compounds containing N, P, and S.

   2.Ionic compounds containing elements such as Sn, Pb, Hg, and As.

   3.Compounds containing alkynes and polyvinyls.

 In order to avoid the above phenomenon, before using glue sealing, the residual rosin on the device should be wiped clean as much as possible, and solder with low lead content should be used as much as possible.

 After use, the rubber hose of this product should be sealed for storage and reuse. This product is for industrial use only.


Packaging specifications

 300ml/bottle, 24 bottles per box.


Storage and transportation

 Store away from children.

 This product has a storage period of six months in an environment below 25 ℃.

 This product is non hazardous and is stored and transported as a general chemical.


What help can we provide for you?

Please inform us of your performance, design, and manufacturing issues. We will utilize our expertise in silicon-based materials, coating knowledge, and processing experience to provide you with services.
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