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Organic silicon thermal conductive gel

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JDB910N Organic silicon thermal conductive gel

JDB910N is a kind of thermal conductive gel with good extrudability and two-component addition molding. It also has excellent thermal conductivity and good electrical insulation performance, making it very suitable for packaging equipment or devices such as motors, power semiconductors, crystal thyristors, rectifiers and transformers.

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Feature

● Resistance to moisture, dirt, and other atmospheric components;

● No solvents, no curing by-products, easy to repair;

● Reduce mechanical stress and tension caused by mechanical, thermal shock, and vibration;

● Stable mechanical and electrical performance between -50 to 200 ℃;

● Excellent flame retardant performance, fully compliant with the EU ROHS directive requirements.

Parameter

項目		典型值		測試标準
混合前物(wù)性(23±2℃/50±5%RH )
組分(fēn)		A	B	--
外觀		灰色膏體(tǐ)	白色膏體(tǐ)	--
粘度 Brookfield DV2T 7#轉子，轉速 10r/min	Pa•s	550±50	550±50	GB/T 2794-2013
比重 g/cm3		1.9±0.10	1.9±0.10	GB/T 533-2008
混合後物(wù)性(23±2℃/50±5%RH )
重量比混合		A:B= 1:1		GB/T 533-2008
外觀		灰色膏體(tǐ)		---
粘度 Brookfield DV2T 7#轉子，轉速 10r/min	Pa•s	550±50		GB/T 2794-2013
可(kě)操作(zuò)時間（100G） min		30-90		--
完全固化時間(100G) --		25℃/24Hours; 80℃/30Min		GB/T 13477.5-2002
固化後性能(néng)( 23±2℃/50±5%RH×24hours )
硬度 Shore00		40±5		GB/T 531. 1—2008
導熱系數 W/m•K		1.5±0.2		ISO22007-2
介電(diàn)強度 kV/mm		≤15		GB/T 1408. 1—2006
介電(diàn)常數(60HZ)		≤4.0		GB/T 1409—2006
體(tǐ)積電(diàn)阻率 Ω ·cm		≥1.0 × 1014		GB/T 1410—2006
介電(diàn)損耗(60HZ)		0.02		GB/T 1409—2006
工(gōng)作(zuò)溫度 ℃		-50～200		--

application

Used for heat dissipation and packaging protection of motors and high-power electronic components, especially for components with high thermal conductivity requirements.

Usage method

Instructions for use

● Clean the surface of the object being glued and keep the clean and dry surface.

● After mixing, the entrained air can be removed by vacuum method, and the air can be extracted at a vacuum degree of 28 "Hg. The bubbles can be removed in 2 minutes, and the extraction time can be extended when the volume is large.

● The product quickly cures at room temperature and fully cures within 24 hours.

matters needing attention

● Before use, please refer to the MSDS in detail.

● Rubber materials should be stored in a sealed manner, and the mixed rubber materials should be used up at once to avoid waste.

● This product is not a hazardous material, but avoid contact with skin and eyes.

● After long-term storage, the filler in the adhesive will settle. Please mix well before use, without affecting performance.

● Contact with a certain amount of the following chemicals can cause the adhesive to not cure:

1. Organic compounds containing N, P, and S.

2. Ionic compounds containing elements such as Sn, Pb, Hg, and As.

3. Compounds containing alkynes and polyvinyls.

● In order to avoid the above phenomenon, before using glue sealing, the residual rosin on the device should be wiped clean as much as possible, and solder with low lead content should be used as much as possible.

Packaging specifications

● Component A, 20kg/barrel Component B, 20kg/barrel

● 400ml dual component rubber hose

Storage and transportation

● Keep away from children, keep components A and B away from light and heat, and store in a sealed container.

● When stored unopened at or below 28 ° C, the product has a shelf life of 6 months from the date of production.

● This product is non hazardous and is stored and transported as a general chemical.

Please read carefully

All data included here was measured at the Jiaduobao laboratory and is only for product selection reference. We recommend conducting sufficient testing in your laboratory or factory to determine whether the product meets all of your requirements.

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Home >> Products >> gel >> Organic silicon thermal condu...

Feature

Parameter

application

Usage method